ECMS aims to lift India’s mobile component localisation to 50% by FY32

India’s Electronics Components Manufacturing Scheme is shifting the focus from phone assembly to local components. With 106 projects approved and ₹69,548 crore in committed investment, the programme targets about 50% domestic mobile bill-of-materials coverage by FY32, up from below 20% today.

— Source publishedMon, 14 Sept, 2026, 14:24 IST·First seen Mon, 14 Sept, 2026, 14:47 IST·Source Financial Express · BrandWagon

What happened

Electronics Components Manufacturing Scheme (ECMS) · India’s ECMS seeks to shift mobile manufacturing from assembly toward local components, targeting about 50%

Key facts

  • 99% of mobile phones sold domestically are assembled in India
  • Domestic mobile Bill of Materials value addition is below 20%
  • ECMS targets around 50% domestic mobile BoM coverage by FY32
  • ECMS outlay increased to Rs 40,000 crore from Rs 22,919 crore
  • 106 projects approved
  • Rs 69,548 crore committed investment
  • Rs 5.34 lakh crore projected component production
  • Rs 12.1 lakh crore electronics production in FY26
  • PCBs have a $7 billion domestic addressable market
  • 85-90% of PCB demand is imported

Why this matters

Corporate development teams should assess partnerships, acquisitions and supplier joint ventures in India’s mobile-component ecosystem, where 106 approved projects and ₹69,548 crore of commitments are accelerating local capacity.

What to watch

  • Commissioning dates and production yields for the 106 approved ECMS projects, rather than committed-investment announcements.
  • Actual domestic bill-of-materials share moving from below 20% toward interim milestones, particularly for displays, camera modules and batteries.
  • OEM disclosures of India sourcing percentages, component qualification wins and reductions in imported subassemblies.
  • Changes in handset average selling prices, retailer gross margins and inventory days in the ₹10,000-₹25,000 segment.
  • Import-duty, production-linked incentive and trade-policy changes affecting components, subassemblies and finished smartphones.
  • Service-center repair turnaround times and spare-parts pricing for locally produced models.
  • Increase procurement and merchandising engagement with OEMs that have disclosed India-based component sourcing plans, especially in batteries, PCBs, cameras and enclosures.
  • Build demand forecasts around more frequent mid-range handset refreshes rather than assuming localization immediately produces lower entry-level prices.
  • Negotiate allocation, replenishment and promotional funding terms tied to locally sourced models, using improved OEM lead times as leverage.
  • Expand attachment offers for accessories, protection plans, trade-ins and repair, as greater domestic parts availability can reduce service turnaround times.
  • Monitor SKU concentration risk: prioritize brands with diversified local supplier bases rather than relying on a single incentive-backed component ecosystem.